A schematic of vivo’s new X Flip foldable clamshell has been revealed by tipster DigitalChatStation. This is the Chinese phone maker’s first clamshell foldable that’s expected to be packing the Snapdragon 8+ Gen 1 chipset. The X Flip is expected to arrive to the Chinese market sometime in early 2023.
vivo X Flip mockup
We can speculate that perhaps there will be either two or three cameras and an LED flash all within the same circular cutout for the cameras. Plus, the use of Zeiss branding would be an interesting choice by Vivo, as clamshell foldables from competitors don’t typically excel in photography as well as their flagship counterparts do.
We don’t know much more about the mystery clamshell foldable. Just earlier today, the same tipster revealed the bit about the X Flip equipping a Snapdragon 8+ Gen 1, but that’s as much as has been revealed.
Source
kloni